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IO-Link Safety Device Stack – for Safety Sensors and Actuators
You develop safety sensors or actuators, so you know the dilemma: a dedicated safety variant for every fieldbus means separate inventory, separate version management and separate field service. So your portfolio stays with OSSD and 4-20 mA. That works, but your devices remain mute: no parameterisation via IODD, no device replacement without a technician, no diagnostic data for IoT and Industry 4.0 – while non-safe sensors have long been communicating over IO-Link.
The obvious ways out come at a price. Implementing a SIL3-capable safety communication layer yourself means shouldering protocol expertise, safety software processes to IEC 61508-3 and the assessment at the notified test body on your own. Months of development time go into infrastructure instead of your actual product – and you carry the entire certification risk yourself.
There is an easier way. IO-Link Safety (IEC 61139-2) puts a lean safety communication layer on top of standard IO-Link as a black channel: up to SIL3 / PLe, fieldbus-independent, one FS device for the global market – whether PROFIsafe, CIP Safety or FSoE runs above it. Safety and standard data share a single cable, and OSSDe operation remains available as a fallback.
With the TEConcept IO-Link Safety Device Stack, manufacturers of safety sensors and actuators integrate IO-Link Safety communication (IEC 61139-2, up to SIL3 / PLe) directly into their devices. The Safety Communication Layer operates as a black channel on standard IO-Link and is fieldbus-independent: one FS device for all FSCPs such as PROFIsafe, CIP Safety or FSoE. Test equipment and assessment support from a single source.
Feasibility Check for Your Safety Device Project
The TEConcept IO-Link Safety Device Stack brings this layer into your device, ready to integrate
- Safety Communication Layer (SCL) and device state machines in accordance with the IO-Link Safety specification
- Built on the proven TEConcept IO-Link Device Stack
Stack, test equipment and certification experience all come from a single source: TEConcept also supplies the IO-Link Safety Master Tester, which notified bodies use to support safety assessments, and accompanies you from integration through to assessment.
The result: your safety portfolio becomes IO-Link-capable without you building up your own safety protocol development. Your engineers focus on the sensor technology, not on CRCs and watchdog concepts. And your device is ready for markets that OSSD alone no longer reaches.
Implementation of the IO-Link Safety Device Stack
Here is what the technical implementation looks like: the TEConcept IO-Link Safety Device Stack is delivered embedded in a demo application – a fully functional IO-Link Safety device. The core safety components are developed and assessed to IEC 61508-3 (SIL3) and enter your assessment unchanged. The demo application shows one example of how a future safety device can be structured.
Hardware
The system can be implemented as a single-channel 1oo1 or a dual-channel redundant 1oo2 architecture. The 1oo2 variant with a second safety CPU (S-Guest) increases diagnostic coverage and supports higher safety requirements.
Architecture of the IO-Link Safety Device Stack
The actual safety function is performed by the Safety Communication Layer (SCL); the Safety Layer Manager (SLM) handles configuration. Both components are developed to IEC 61508-3 and are adopted unchanged.
Ready-made modules for cyclic and acyclic data transfer are available for communication between the processors. They form the transmission path (black channel) and can either be adopted as they are or replaced with your own components.
The underlying physical layer is exchangeable and is adapted to the respective hardware.
The safety application demonstrates how a safety sensor or actuator can be built on this foundation. This part is intended as a template and is modified as required.
Footprint of the IO-Link Safety Device Stack
The size of the compiled code depends heavily on the configuration used and on compiler optimisation. The following figures serve as a guide.
S-Host/S-Guest: 38k Flash, 6k RAM Com-CPU: 23k Flash, 4k RAM
Contact
- +49 761 21443640
- +49 761 21443636
- info@teconcept.de
Please use our contact form if you have further questions about our IO-Link Safety Device Stack—also for additional project ideas or questions about our other products. The more precise your information, the more specifically we can respond.