
From Nanjing to Budapest: IO-Link Events 2026 in Review and Outlook
A recap of the first IO-Link Interop and the PI Conference in China — plus an outlook on the upcoming
Build and expand expertise
Core components for IO-Link
Quick start into IO-Link development
Tools & software for IO-Link device development
IO-Link Community–certified test systems
Stacks, Development, Diagnostic & Test Tools
Your partner for intelligent IO-Link solutions
First step to product success
With proven development tools
With test systems approved by the IO-Link Community
Fast, flexible, market-oriented
Makes investment & security profitable
Answers to Asked IO-Link Questions
Data Sheets & Software Versions
Hands-On Training for Your Team
Regular IO-Link Community formats we take part in:
Community meetings with presentations
Hands-on training for users
Interoperability Tests for Manufacturers
Build and expand expertise
Core components for IO-Link
Quick start into IO-Link development
Tools & software for IO-Link device development
IO-Link Community–certified test systems
Stacks, Development, Diagnostic & Test Tools
Your partner for intelligent IO-Link solutions
First step to product success
With proven development tools
With test systems approved by the IO-Link Community
Fast, flexible, market-oriented
Makes investment & security profitable
Answers to Asked IO-Link Questions
Data Sheets & Software Versions
Hands-On Training for Your Team
Regular IO-Link Community formats we take part in:
Community meetings with presentations
Hands-on training for users
Interoperability Tests for Manufacturers

A recap of the first IO-Link Interop and the PI Conference in China — plus an outlook on the upcoming

TEConcept is participating in IO-Link Interop 2026 from September 22–23 in Bad Soden and testing Master, Device, and Safety Tester

The EU Cyber Resilience Act obliges manufacturers of digital products to provide cybersecurity evidence starting in September 2026 – TEConcept

With IO-Link V1.1.5, TEConcept has updated its entire product range – Master and Device Stacks support the new specification across
The TEConcept IO-Link Aggregator Device combines four IO-Link master ports with configurable real-time signal processing, bringing edge intelligence to where
IO-Link Debugging in Practice: Measure signal waveforms with the IO-Link Signal Exposer and analyze communication with the IO-Link Spy –

The decision has been made: the new sensor or actuator product is to become IO-Link capable. This often happens due

Anyone working with IO-Link in real-world machines knows this situation: The system is generally stable, but from time to time,

Everything at a glance: The new TEConcept Product Booklet
The new booklet provides a structured overview of our current

Shortly before the end of the year, many service and commissioning teams face the same question: Which tool really makes

The new version introduced snippet-based testing. While this may sound unspectacular, it is currently causing many manufacturers a headache.

Anyone working with IO-Link in real-world machines knows this situation: The system is generally stable, but from time to time,

Preconfigure and test IO-Link masters – without any real devices. The COD from TEConcept emulates IO-Link devices, saves time and