EMC Test Master for IO-Link
The IO-Link specification defines procedures for testing the EMC robustness of IO-Link devices. Among other things, the sensitivity of IO-Link communication of IO-Link devices under EMC conditions is verified. This requires a robust master that is significantly less sensitive to EMC noise than the device under test. This is achieved by separating the IO-Link Master into two parts: Part 1 contains the sensitive digital logic (µC box), and Part 2 contains the IO-Link transceiver (PHY box).
Both parts are separated by an optical connection with a length of up to 10 m.
EMC Test System Specifications
- Complies with IO-Link Interface Specification V1.1.2 and the current IO-Link Test Specification.
- Error and signal output
- 4 electrical IO-Link port configurations
COM1 / 2 port (good signal)
COM1 / 2 port (bad signal)
COM3 port (good signal)
COM3 port (bad signal) - RS232 and USB interfaces
- Terminal-based control command set
- Additional EMC test and control software with graphical user interface
- Test report generation in PDF format
- Can be configured for operation as a standard “USB IO-Link Master“
- Firmware update supported
Advantages
- Sensitive parts are located outside the EMC chamber
- EMC robustness significantly better than required
Contact
- +49 761 21443640
- +49 761 21443636
- info@teconcept.de
If you have any questions about the EMC Test Master for IO-Link, please feel free to contact us via our contact form. Our team is at your disposal.
